Key Features

   High Thermal Conductivity

   Low Dielectric Constant

   Low Dielectric Loss

Applications

   Heat Emission for Power Semiconductor Devices and IC

   Tubes and Rods

   Bars, Plate and Blocks

Beryllia (BeO)

Characteristics of Material

Technical Parameters	Unit	Value
Bulk Density	g/cm3	2.9
Mohs Hardness		8
Thermal Expansion Coefficient	×10-6/℃	7 ~ 8.5
Modulus of Elasticity	GPa	345
Flexural Strength	MPa	205
Tensile Strength	MPa	125
Compressive Strength	MPa	1550
Dielectric Constant (at1MHz )		6.7
Dielectric Loss Angle (at1MHz )	×10-4	5
Dielectric Strength	KV/mm	10 ~ 14
Thermal Conductivity (at 25℃)	W/m.K	250
Volume Resistiity (at 25℃)	Ωcm	> 1014