Key Features

   Lower Thermal Expansion Coefficient

   Lower Dielectric Constant and Loss

   Higher Flexural Strength

Applications

   Ceramic-metal Housings for Rectifier and Thyristor         Thick Film and Thin Film

   Ceramic Substrates for Power Semiconductor Device      Direct Copper Bonded

   Bolts, Nuts, Washers       Plates, Discs

   Standoff Insulators

Alumina (Al₂O₃)

Technical Parameters	Unit	Value
Alumina Content	%	93	96	99
Bulk Density	g/cm3	3.6	3.7	3.8
Water Absorption	%	0	0	0
Flexural Strength	Mpa	> 310	> 310	> 340
Yong's Modules	GPa	290	330	370
Dielectric Constant (at 1MHz)		8.8	9.4	9.9
Dielectric Loss Angle (at 1MHz)	×10-4	6	4	2
Dielectric Strength	kV/mm	> 15	> 15	> 15
Thermal Expansion Coefficient	×10-6/℃	7.1	7.2	7.3
Thermal Conductiity (at 20 ℃)	W/m.K	22	27	33
Volume Resistiity (at 20 ℃)	Ωcm	> 1014	> 1014	> 1014