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  • Cut Wafers


    Diameter

    mm

    < Φ 50.8 upon special request

    > Φ 125 upon special request

    Φ 50.8 Φ 76.2 Φ 100 Φ 125

    Thickness (μm) std.

    min.

    260

    180

    300

    210

    320

    240

    380

    300

    Thickness std.

    Tolernace (μm) min.

    ± 15

    ± 10

    TTV (μm) std.

    typ.

    10

    5

    10

    7

    15

    10

    25

    15

    Bow (μm) max.

    (distressed)

    10

    15

    20

    40

    Special Options

    Great variety of edge profiles available ingot off orientation max. ±7°

  • Cut Wafers
    Document Format File Size
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    Cut Wafers Spec Sheet 75.2 KB